Thermal monitor

The purpose of the Adaptive Thermal Monitor is to reduce processor IA core power consumption and temperature until it operates below its maximum operating temperature. Processor IA core power reduction is achieved by: Adjusting the operating frequency (using the processor IA core ratio multiplier) and voltage. Modulating (starting and stopping) the internal processor IA core clocks (duty cycle). The Adaptive Thermal Monitor can be activated when the package temperature, monitored by any Digital Thermal Sensor (DTS), meets its maximum operating temperature. Reaching the maximum operating temperature activates the Thermal Control Circuit (TCC). When activated the TCC causes both the processor IA core and graphics core to reduce frequency and voltage adaptively. The Adaptive Thermal Monitor will remain active as long as the package temperature remains at its specified limit. Therefore, the Adaptive Thermal Monitor will continue to reduce the package frequency and voltage until the TCC is de-activated. Maximum Operating Temperature is factory calibrated and is not user configurable. The default value is software visible in the TEMPERATURE_​TARGET (1A2h) MSR, bits [23:16]. The Adaptive Thermal Monitor does not require any additional hardware, software drivers, or interrupt handling routines. It is not intended as a mechanism to maintain processor thermal control to PL1 = Processor Base Power. The system design should provide a thermal solution that can maintain normal operation when PL1 = Processor Base Power within the intended usage range. Adaptive Thermal Monitor protection is always enabled. TCC Activation Offset TCC Activation Offset can be set as an offset from maximum operating temperature to lower the onset of TCC and Adaptive Thermal Monitor. In addition, there is an optional time window (Tau) to manage processor performance at the TCC Activation offset value via an EWMA (Exponential Weighted Moving Average) of temperature. TCC Activation Offset with Tau=0 An offset (degrees Celsius)

Amount of hysteresis has been included to prevent excessive clock modulation when the processor temperature is near its maximum operating temperature. Once the temperature has dropped below the maximum operating temperature, and the hysteresis timer has expired, the Adaptive Thermal Monitor goes inactive and clock modulation ceases. Clock modulation is automatically engaged as part of the Adaptive Thermal Monitor activation when the frequency/voltage targets are at their minimum settings. Processor performance will be decreased when clock modulation is active. Snooping and interrupt processing are performed in the normal manner while the Adaptive Thermal Monitor is active. Clock modulation will not be activated by the Package average temperature control mechanism. Thermal Throttling As the processor approaches Maximum Operating Temperature a throttling mechanisms will engage to protect the processor from over-heating and provide control thermal budgets. Achieving this is done by reducing IA and other subsystem agent's voltages and frequencies in a gradual and coordinated manner that varies depending on the dynamics of the situation. IA frequencies and voltages will be directed down as low as LFM (Lowest Frequency Mode). Further restricts are possible via Thermal Throttling point (TT1) under conditions where thermal budget cannot be re-gained fast enough with voltages and frequencies reduction alone. TT1 keeps the same processor voltage and clock frequencies the same yet skips clock edges to produce effectively slower clocking rates. This will effectively result in observed frequencies below LFM on the Windows PERF monitor.

Relative: see also Cooling, Thermal, Syscon Thermal ConfigsMotherboard Thermal Management[edit | edit source]All the thermal sensors of the PS3 motherboard are connected to syscon, the current temperatures are compared with the settings of a syscon EEPROM region named thermal config and based in the results of the comparison syscon sets a fan speedCELL BE Internal Powermanagement[edit | edit source]Dynamic Power Managment with 5 power managment states1 linear sensor (diode)10 digital thermal sensors (8xSPE, PPE and ?)RSX internal Powermanagement[edit | edit source]1 linear sensor (diode)Internal selfmanagement: UnknownTemperature Monitors[edit | edit source]The internal circuitry of CELL, RSX, and other components of the PS3 motherboard contains temperature sensors (also known as diodes) that outputs an analog signal throught 2 lines (named D+ and D-), this signal is taken by a dedicated chip named "temperature monitor" that converts it to digital (bytes)The connection in between syscon and the thermal monitors is made by a protocol named SMBus with 2 lines named SCL (serial clock) and SDA (serial data). Syscon is the master of the SMBus and the thermal monitors are the slaves connected in cascade to the same 2 lines of the SMBus. Syscon generates the SCL clock signal (the clock is an output of syscon, and a input for the monitors), and the SDA data signal is bidirectionalSMBus protocol is based on the I2C protocol, there are some differences but a lot more things in common, all the slaves connected to the SMBus have a unique address given by the manufacturer of the component (and cant be changed, this is why each thermal monitor of the PS3 motherboard have a different component name (as example TMP411A for CELL and TMP411B for RSX)The SMBus lines are protected in internal layers of the motherboard between 2 ground layers to shield them against interferencesSee also:System Management Bus (SMBus) Specification, version 2.0.PDF (03-Aug-2000)System Management Bus (SMBus) Specification, version 3.1.PDF (19-Mar-2018)Texas Instruments TMP411 Product pageTexas Instruments TMP411 ±1°C Remote and Local Temperature Sensor With N-Factor and Series Resistance Correction.PDF (February 2007)Texas Instruments TMP411 ±1°C Remote and Local Temperature Sensor With N-Factor and Series Resistance Correction.PDF (December 2016)Onsemi ADT7461 Product page and Onsemi ADT7461A Product page (design previously property of Analog Devices Inc.)Analog Devices Product Line Sold to Onsemi (December 31, 2007)Analog Devices ADT7461 ±1°C Temperature Monitor with Series Resistance Cancellation (2003 Rev 0)Analog Devices ADT7461* ±1°C Temperature Monitor with Series Resistance Cancellation (2005 Rev B)Onsemi ADT7461 ±1°C Temperature

IA core will scale the operating points such that: The voltage will be optimized according to the temperature, the processor IA core bus ratio and the number of processor IA cores in deep C-states. The processor IA core power and temperature are reduced while minimizing performance degradation. Once the temperature has dropped below the trigger temperature, the operating frequency and voltage will transition back to the normal system operating point. Once a target frequency/bus ratio is resolved, the processor IA core will transition to the new target automatically. On an upward operating point transition, the voltage transition precedes the frequency transition. On a downward transition, the frequency transition precedes the voltage transition. The processor continues to execute instructions. However, the processor will halt instruction execution for frequency transitions. If a processor load-based Enhanced Intel SpeedStep® Technology/P-state transition (through MSR write) is initiated while the Adaptive Thermal Monitor is active, there are two possible outcomes: If the P-state target frequency is higher than the processor IA core optimized target frequency, the P-state transition will be deferred until the thermal event has been completed. If the P-state target frequency is lower than the processor IA core optimized target frequency, the processor will transition to the P-state operating point. Clock Modulation If the frequency/voltage changes are unable to end an Adaptive Thermal Monitor event, the Adaptive Thermal Monitor will utilize clock modulation. Clock modulation is done by alternately turning the clocks off and on at a duty cycle (ratio between clock “on” time and total time) specific to the processor. The duty cycle is factory configured to 25% on and 75% off and cannot be modified. The period of the duty cycle is configured to 32 microseconds when the Adaptive Thermal Monitor is active. Cycle times are independent of processor frequency. A small

Thermal cameras have been an excellent addition to drones. Applications such as surveillance and inspection work are furthered with thermal technology. Every object and surface will have a heat signature, thermal sensors are able to detect thermal radiation emitted by objects and environments, allowing users to visualise temperature differences and thermal patterns. Thermal cameras can detect the surface temperature of many objects, but there are exceptions. For example, highly polished, shiny and reflective objects do not absorb much heat — they have what is known as low emissivity. These are hard to detect on thermal cameras. High emissivity objects like wood, concrete — and even people — are easy to scan.Thermal cameras on drones work by detecting the heat emitted by objects, with warmer objects appearing brighter or contrasting against cooler surroundings in the thermal imagery. This technology uses sensors that can detect infrared radiation, converting it into a visual representation of temperature differences. Thermal imaging drones are unmanned aerial vehicles (UAVs) or drones equipped with thermal cameras or infrared (IR) cameras. Thermal imaging drones have various applications across different industries, thanks to their ability to detect heat variations and provide valuable insights. Here's an overview of what thermal imaging drones are and their applications:1. Search and Rescue: Thermal imaging drones are invaluable tools for locating missing persons or survivors in various conditions, including dense forests, rugged terrains, and disaster-stricken areas. Heat signatures can help search teams spot individuals, especially at night or in low-visibility conditions.2. Building Inspections: In construction and building inspections, thermal imaging drones can identify areas with poor insulation, moisture intrusion, or potential electrical issues by detecting temperature anomalies within structures.3. Electrical and Mechanical Inspections: Electricians and maintenance teams use thermal drones to identify overheating electrical components, loose connections, or faulty machinery. This helps in preventing equipment failures and electrical fires.4. Agriculture: In precision agriculture, thermal imaging drones assess crop health, optimise irrigation, and identify pest infestations. Temperature differences in crops and soil can reveal crucial insights for farmers.5. Wildlife Monitoring: Conservationists and wildlife researchers use thermal imaging drones to study wildlife behavior, monitor animal populations, and combat poaching. Heat signatures of animals can be detected even in low-light conditions.6. Firefighting: Firefighters use thermal drones to assess the intensity and direction of fires, locate hotspots, and ensure the safety of personnel during firefighting operations.7. Environmental Surveys: Thermal imaging drones help scientists and environmentalists monitor ecosystems, detect forest

Can be written to the TEMPERATURE_​TARGET (1A2h) MSR, bits [29:24], the offset value will be subtracted from the value found in bits [23:16]. When the time window (Tau) is set to zero, there will be no averaging, the offset, will be subtracted from the Maximum Operating Temperature value and used as a new maximum temperature set point for Adaptive Thermal Monitoring. This will have the same behavior as in prior products to have TCC activation and Adaptive Thermal Monitor to occur at this lower target silicon temperature. If enabled, the offset should be set lower than any other passive protection such as ACPI _​PSV trip points. TCC Activation Offset with Tau To manage the processor with the EWMA (Exponential Weighted Moving Average) of temperature, an offset (degrees Celsius) is written to the TEMPERATURE_​TARGET (1A2h) MSR, bits [29:24], and the time window (Tau) is written to the TEMPERATURE_​TARGET (1A2h) MSR [6:0]. The Offset value will be subtracted from the value found in bits [23:16] and be the temperature. The processor will manage to this average temperature by adjusting the frequency of the various domains. The instantaneous Operating Temperature can briefly exceed the average temperature. The magnitude and duration of the overshoot is managed by the time window value (Tau). This averaged temperature thermal management mechanism is in addition, and not instead of Maximum Operating Temperature thermal management. That is, whether the TCC activation offset is 0 or not, TCC Activation will occur at Maximum Operating Temperature. Frequency / Voltage Control Upon Adaptive Thermal Monitor activation, the processor attempts to dynamically reduce processor temperature by lowering the frequency and voltage operating point. The operating points are automatically calculated by the processor IA core itself and do not require the BIOS to program them as with previous generations of Intel processors. The processor