Power layers

Author: c | 2025-04-24

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Part 1 of this series described how digital signals propagate through PC boards [Refs. 1, 2, 5, 6]. In part 2, we look at specific board designs to achieve low EMI. The biggest issue I see in my clients’ board designs is poor layer stack-up.Reiterating the two fundamental rules from part 1 and realizing digital signals and power (transients) are electromagnetic waves moving in the dielectric layer, we see there are two very important principles when it comes to PC board design:Every signal and power trace (or plane) on a PC board should be considered a transmission line.Digital signal propagation in transmission lines is really the movement of electromagnetic fields in the space between the copper trace and GRP.To construct a transmission line, you need two adjacent pieces of metal that capture or contain the field. For example, a microstrip over an adjacent ground return plane (GRP) or a stripline adjacent to a GRP or a power trace (or plane) adjacent to a GRP. For example, locating multiple signal layers between power and ground reference planes will lead to real EMI issues for fast signals. Observing these two rules will dictate the layer stack-up. In other words, every signal or power trace (routed power) must have an adjacent GRP and all power planes should have an adjacent GRP. Multiple GRPs should be tied together with a matrix of stitching vias. In this article, we’ll examine several stack-up designs. 03.11.2025 03.06.2025 03.05.2025 Typical six-layer design (Altium) One stack-up I frequently see is this six-layer design (Figure 1). This probably worked well enough in the 1990s through early 2000s, but with today’s much faster and mixed signal technologies, it’s recipe for EMI disaster. There are two issues with this: the bottom two signal layers are referenced to the power plane and the power and ground return planes are non-adjacent and too far apart. Figure 1 A very common, but poor, EMI stack-up design (6-layer example). Signal layers 4 and 6 are referenced to power, while the GRP and power planes are non-adjacent with two signal layers in between. This will couple power transients on those two signal layers.With few exceptions (some DDR RAM power and signals, for example) currents want to return to their sources, which are referenced to the GRP. Referencing these signals to the power plane is very EMI-risky, because there is no clearly defined return path, except through plane-to-plane capacitance, which in this case is relatively small. In addition, these gaps in the return path result in field leakage into other areas of the board’s dielectric layers. That, in turn, leads to cross-coupling and radiated EMI.The second issue occurs when we have the power and GRP separated by two signal layers. Any power network transients will cross-couple within the dielectric layers, coupling to any signal traces on layers 3 and 4 along the way. You also lose any plane-to-plane capacitance benefit if these planes are separated by more than 3-4 mils.The following are a several ideas for PC board What goes around comes aroundDo you believe in karma? There are some that say whatever you believe is effectively true as it will determine your actions. That may be true; however, there are some realities that are independent of whether anyone believes in them or not. Actions having reactions is one of these. Or if you like, what goes around comes around.An inescapable reality of PCB design is that your signals must have a return path for your circuits to function. This is true for all signals, analog, digital and power. For simple, less complex circuits; such as single and double-layer boards, traces are sufficient to provide the necessary return paths. However, for smaller boards with more complex routing, multilayer PCBs with vias is required. For multilayer boards, it is essential that good stackup layer tips are employed, which includes determining the best usage for signal, ground and power planes. Dedicating a layer(s) to power is less common than signal and ground power planes and poses some unique challenges. Let’s explore these by determining the best techniques for a 4 layer power plane design. 4 Layer PCB Stackup Design A multilayer PCB is defined as having “3 or more” conductive layers, where each internal layer may be for signals, ground or power. Although, it is possible to design a 3 layer board with a power plane, practically, a 4 layer PCB, shown in the figure below, is most likely the smallest stackup that will contain a power layer. 4 layer PCB structureAs shown in the figure above, a 4 layer stackup includes two internal layers. This means that your board will include blind vias. Most often, one of these will be a signal layer and the other a ground plane. However, both internal layers may be ground planes, as there are EMI advantages to having parallel ground layers. Another stackup alternative is to have a power plane and a ground plane; however, it is highly inadvisable to have two internal signal layers adjacent to each other. There are also situations where multiple power planes may be needed, but there are significant challenges to be considered for these designs, as discussed below.4 Layer PCB Power Plane Design ChallengesWhen designing multilayer boards of any number of layers there are some stackup tips that should be followed to ensure the operation and help facilitate your board’s manufacturing. These include; configuring your stackup symmetrically and minimizing the distance between ground and power planes. Adhering to these and other multilayer stackup design guidelines pose challenges for 4 layer power plane designs, as listed below.Design Challenges: Multiple power planes For high functionality PCBs, it is not uncommon for components to have different voltage level requirements for

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Stack-ups that comply with the transmission line aspects of digital signal propagation.Four-layer board: Design 1 A good four-layer board stack-up for improved EMI (Figure 2). Instead of a power plane, we use either routed or poured power, along with signals on layers 2 and 3. Thus, each signal/power trace is adjacent to a GRP. Also, it’s easy to run vias between all layers, so long as the two GRPs are connected together with a matrix of stitching vias. If you run a row of stitching vias along the perimeter (say, every 5mm) you form a Faraday cage. Figure 2 This good four-layer board stack-up for improved EMI keeps the signals and routed power near the ground reference planes.Four-layer board: Design 2 If, on the other hand, you’d prefer to have access to the signal and routed/poured power traces, you may simply reverse the layer pairs, such that the two GRP layers are in the middle and the two signal layers are positioned at the top and bottom, with routed power and sufficient decoupling caps, rather than a power plane (Figure 3). Figure 3 This good four-layer board stack-up for improved EMI places the ground reference planes inside the board.For both four-layer designs, you want to run a pattern of stitching vias connecting the two GRPs about 1cm apart, maximum.Eight-layer board (Altium) Both the four- and eight-layer board designs (Figure 4) follow the two fundamental rules that preserve good transmission line design. In addition, for the eight-layer design, the power and GRP planes are now 4 mils apart, providing fairly good plane-to-plane capacitance. Closer would even be better. For example, a spacing of 1 mil to 3 mils is ideal for minimizing EMI. All GRPs should be stitched together with a 1 cm pattern of vias. Figure 4 A good EMI stack-up design (8-layer example). All signal layers are referenced to an adjacent GRP, while power is also referenced to an adjacent GRP.Of course, there are many more iterations on creating proper transmission line pairs between signal and GRP or power and GRP.What about two-layer boards? Simple, just run signals and routed power on layer 1 and use a GRP on layer 2. Well, that may have worked in yesterday’s technology. in today’s technology, we often need to use at least two layers to run signals. The answer is to run “triplets” with a ground return trace between two signal traces (Figure 5). This was an idea from Daniel Beeker, Senior Applications Engineer with NXP Semiconductor [Ref 5]. Figure 5 An example of routed triplets for signals, as well as attempting to preserve the transmission line principles for routed power. Courtesy: Daniel Beeker, NXP SemiconductorHere, we see an attempt to preserve the transmission line properties for the routed power. The example also shows analog signal traces with a ground return trace between them—a routed “triplet.” Because the electromagnetic field is captured adequately between each signal trace and the return trace, there is little field leakage.If you’d like to learn much more. Power Layers 1.1 - Download Page. Description: Power Layers allows to work with the several images as with layers Download Power Layers 1.1. Power Layers was downloaded from

Layers of the power cable

IntroductionPrinted Circuit Board (PCB) design is a crucial aspect of modern electronics, serving as the foundation for the development and manufacturing of electronic devices. PCBs are the backbone of electronic products, providing the necessary interconnections and support for various components. The PCB design process involves creating a layout that optimizes the placement of components, routing of traces, and ensuring the overall functionality and reliability of the circuit.This series delves into the intricacies of PCB design, covering a wide range of topics essential for both beginners and experienced designers. Here’s the breakdown: Part one establishes a strong foundation, exploring the design workflow – from schematic capture to layout and crucial design rule checks. We'll examine PCB components and layers, then examine signal integrity and thermal management – essential for crafting high-performance PCBs.Part two will focus on translating PCB design into reality, exploring the intricacies of PCB manufacturing, assembly, testing, and debugging. Finally, we'll navigate the industry's leading PCB design software and tools, setting the path to creating high-performance electronic devices.Now, let’s start with the fundamentals of PCB design! Fundamentals of PCB DesignPrinted Circuit Board (PCB) design involves the creation of a layout that defines the electrical connections and mechanical structure of an electronic device. Understanding the basic concepts and terminology related to PCB design is essential for creating reliable and efficient electronic products.Single-sided vs Double-sided vs Multi-layer PCBsPCBs are classified into different types based on their construction and their number of conductive layers. Single-sided PCBs have components and traces on only one side of the board, while double-sided PCBs utilize both sides for component placement and routing. Multi-layer PCBs consist of three or more conductive layers, allowing for more complex designs and higher component density.The choice of materials used in PCB fabrication plays a crucial role in the performance and reliability of the final product. The most common base material for PCBs is FR-4, a glass-reinforced epoxy laminate. [1] Other materials, such as polyimide or high-frequency laminates, may be used for specific applications that require enhanced thermal stability or improved electrical properties.PCB Layers and Their FunctionsA typical PCB consists of multiple layers, each serving a specific purpose in the overall design. The conductive layers, usually made of copper, are used for routing electrical signals and power between components. The number and arrangement of these layers depend on the complexity of the design and the required functionality.Conductive pathways on Printed Circuit Board (PCB)The layer stack up design is crucial for maintaining signal integrity and ensuring the proper functionality of PCB. A well-designed layer stackup considers factors such as signal return paths, impedance control, and crosstalk reduction. Common layer configurations include power and ground planes, signal layers, and dedicated layers for specific purposes like shielding or heat dissipation.For example, a four-layer PCB may have a layer stackup consisting of a top signal layer, a ground plane, a power plane, and a bottom signal layer. This configuration establishes a stable foundation for signal transmission, reduces electromagnetic interference (EMI) disruptions, and facilitates effective power distribution. Of needing to route RF and digital traces back and forth across the board. This then creates more spots where strong crosstalk can occur, and it becomes more difficult to track your return path throughout the board. Floorplanning needs to be done alongside another important task: designing the PCB stack-up.RF Devices: PCB Stackup DesignsThe stack-up design is related to floorplanning in that your routing strategy and layout will require a grounding strategy, especially at practical RF frequencies. The PCB stack-up you use will determine your power and ground access in the PCB layout, as well as available space for routing signals in your board. An example of an 8-layer count PCB stack-up you can use for an RF design is shown below. Although this is not typical, it provides the pattern for selecting layers and arranging signal vs. plane layers in the stack-up for low-speed, high-speed, and RF signals.Example 8-layer stack-up with low-speed digital, high-speed digital, and RF signals on different layers.In this example stack-up, there are traces on the top surface layer to provide direct connections between high-frequency analog components; these could be routed in any of the routing styles I’ll present below. Directly below this, we have ground/power planes, which are adjacent to provide interplane capacitance and to ensure stable power is delivered throughout the system (both for digital and analog components). In the internal layers, we can have other (lower frequency) RF signals, or we can have low-speed digital signals. On the bottom surface, I’ve allowed for the possibility of high-speed digital signals, although we could have these various signals mixed across the top and bottom layers as long as the return paths are controlled.Another example that is close to a typical high-speed digital PCB stackup is shown below. This example also uses alternating signal and plane layers as we would expect, but it includes a dedicated power layer. This would be used in, for example, instances where we had multiple rails at different voltages required for the RF and digital components on the board. This is the type of stackup we would want if we were

The power and signal plane layers of the PCB. (a) Layer 1: signal layer

High performance, ease of use, and affordability have one thing in common: "ICAP/4Windows," Intusoft's advanced analog and mixed-signal simulation solution. ICAP/4 is very affordable and power packed. It features a fully integrated set of design management, simulation, debug and verification tools. Whether you are looking to upgrade your evaluation version of ICAP/4, or getting started with a robust SPICE offering, ICAP/4Windows strikes a perfect balance between ease-of-use, power and low price. ICAP/4Windows includes "SpiceNet," Intusoft's 5th-generation design entry tool. SpiceNet provides a patented layering and configuration system that enables the creation of different schematic layers (example: power supply, signal processing section, amplification circuitry and final output stage), quick wiring between layers, and "highlighted" visibility of all layers from the composite design. Schematic layers can be saved to create different design configurations for debugging initial design functionality, regression testing, production, military standard, PCB layout, etc. Design changes invoked in one configuration are automatically propagated to all other versions, thus saving time and optimizing design management. SpiceNet even displays operating point data, waveforms, and user-created artwork and text directly on the schematic at the click of the mouse. It also includes footprint information for operation with the Bartels AutoEngineer PCB layout and route software. Of course ICAP/4Windows features the industry's legendary "IsSpice4" analog and mixed-signal simulation kernel, including countless enhancements for optimum DC convergence, speed and handling tough designs. An extensive set of more than 21,200 component models is included in ICAP/4 Windows. You won't experience usual production fallout because advanced verification

Humidity-Controlled Ultralow Power Layer-by-Layer Thinning

High performance, ease of use and affordability have one thing in common: "ICAP/4Windows Power Deluxe." This simulation package is an extended version of ICAP/4Windows, including vastly enhanced simulation capability for power electronic design. This full-featured offering includes everything you need to design and verify all types of board, engineering system and IC-level design. ICAP/4Windows Power Deluxe strikes a perfect balance between ease-of-use, technological strength and low price. ICAP/4Windows Power Deluxe includes "SpiceNet," Intusoft's 5th-generation design entry tool. SpiceNet provides a patented layering and configuration system that enables the creation of different schematic layers (example: power supply, signal processing section, amplification circuitry and final output stage), quick wiring between layers, and "highlighted" visibility of all layers from the composite design. Schematic layers can be saved to create different design configurations for debugging initial design functionality, regression testing, production, military standard, PCB layout, etc. Design changes invoked in one configuration are automatically propagated to all other versions, saving time and optimizing design management. SpiceNet even displays operating point data, waveforms, and user-created graphical shapes and text directly on the schematic at the click of the mouse. It also includes footprint information for operation with the Bartels AutoEngineer PCB layout and route software. ICAP/4Windows Power Deluxe features a dedicated Power library of more than 1000 devices, increasing its already robust model count to 22,000+ parts. These work with the IsSpice4 kernel's enhanced algorithms tailored for advanced power design. Library elements run the course, featuring new hysteretic average models; General Feedback Theorem (GFT) models for measuring open loop response without breaking a closed design loop; 30 power supply schematic templates with various ICs and custom power components for SMPS design; and a gamut of many other ready-to-use power devices. The package also provides SpiceMod, ICAP/4's model building tool that easily creates and tests new models from manufacturers' datasheet entry. And Library Manager organizes and archives models, including comparison and search capability. With today's demanding analog and mixed-signal design, simulation power, ease of use and affordability lie at the apex of tool requirements, as provided by ICAP/4Windows Power Deluxe. But this is only the start of a long list of benefits found in this offering. See if the features listed below clearly make this offering the best choice for your design needs. Highlights IsSpice4: Intusoft's significantly enhanced SPICE 3.F5 and XSPICE based simulation kernel Unlimited circuit size for simulation of large-scale mixed-signal ICs, circuits and systems Mixed mode simulation, including digital components with timing parameters, behavioral blocks for special components and mixed-engineering system design Fully integrated design entry and simulation system, interactive for fast design changes and debug Unprecedented technical support program, full documentation and on-line help within all applications Simulation Environment All SPICE analyses:. Power Layers 1.1 - Download Page. Description: Power Layers allows to work with the several images as with layers Download Power Layers 1.1. Power Layers was downloaded from

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